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テープ穿孔 せんこう機構 きこうで
tēpusenkō kikōde

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Noun
, 
Da Copula

て-form: Used to connect clauses, make requests, or chain actions of テープ穿孔機構

1. Tape perforation mechanism.

Te-Form
, 
Computing

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テープ穿孔機構で

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